iMAPS New England Chapter

42nd Symposium & Expo
Tuesday May 5th 2015
Holiday Inn Boxborough Woods, Boxborough, MA



Symposium Technical Program Chairs Tom Green and Dmitry Marchenko

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President's Welcome Letter

Welcome to IMAPS New England 42nd Annual Symposium and Expo - John Blum, New England IMAPS Chapter President

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Technical Chair's Welcome Letter

Welcome Letter - Thomas J. Green and Dmitry Marchenko, Technical Program Chairmen

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Symposium Program

Booklet - Abstracts, Vendors, and pictures

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Keynote Speaker

Amandine Pizzagalli – Yole Développement
3D Technology Trends & Key Manufacturing Challenges

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Session A:

RF and Microwave - Innovations & Emerging Technologies - Part I

Session Chairs: Tom Terlizzi , and Dr. Chandra Gupta

Surface Mount Multi-Layer Ceramic Capacitors for RF Power Applications
Abstract Presentation
J. Rogers, Vishay Intertechnology Inc. One Greenwich Place Shelton, CT 06484

Contract Manufacturing for the RF Microwave World
Abstract Presentation
Jim Morgan, SemiGen, Manchester, NH

Nonlinear Effects in Active Phased Array System Performance
Abstract Presentation
Dr. Larry Williams, ANSYS Corporation, Irvine, CA

Designing and Building Microwave Circuits in LTCC
Abstract Presentation Paper
Prakash Bhartia, Natel Engineering Co., Inc., Chatsworth, CA

100nm GaN on Si: A Pioneering Technology to Enable High RF Power in Millimeter Wave Bands
Abstract Presentation
Dr. Fabien Robert, OMMIC, France

Session B:

Advanced Technologies for 2.5/3D Packaging

Session Chairs: Maria Durham and Ken Araujo

TSV Impact on Chip Package Interaction for 20nm Silicon
Abstract Presentation
Sukeshwar Kannan, GLOBALFOUNDRIES US Inc., Malta, NY

Epoxy Underfill Challenges for Copper (Cu) Pillar Solder Bump Packages
Abstract Presentation
Ken Araujo, Kohara – NAMICS Technologies, San Jose, CA

Ultralow Residue (ULR) Semiconductor Grade Fluxes for Flip-Chip and MEMs Applications
Abstract Presentation
Maria Durham, Indium Corporation, Clinton, NY

Void Reduction and Elimination for Reflow & Curing Processes
Abstract Presentation
Tom Nash, Heller Industries, Florham Park, NJ

Cost Structure Advantages of 2.5D Integration
Abstract Presentation
Javier DeLaCruz, eSilicon Corporation, San Jose, CA

Glass Enabled Systems Integration
Abstract Paper
Jeb Flemming, 3D Glass Solutions, Albuquerque, NM

Session C:

MEMS & Nano Technology for UAV, Energy, Security & Biomedical

Session Chairs: Dr. Parshant Kumar and Dr. Latika Menon

Aerodynamic Testing of MEMS Surface Sensors
Abstract Presentation
Robert D. White, Tufts University, Medford MA

Optical Leak Testing of Small Devices – OLT Technology
Abstract Presentation Paper
Tom Trafford, NorCom Systems Inc., Norristown, PA

ZnO and Related Nanostructures for Electronics and Photonics
Abstract Presentation
Mehdi Anwar, University of Connecticut, Storrs, CT

One-Dimensional Nanostructures for Energy and Electronics Applications
Abstract Presentation
Latika Menon, Dept. of Physics, Northeastern University, Boston, MA

Advanced Fault Isolation for Microelectronic Packaging Yield and Reliability Enhancement
Abstract Presentation
David P. Vallett, PeakSource Analytical, LLC, Fairfax, VT

Fabrication and Application of A Novel Electrochemical Sensor based on Pt Nanowire Array Coated with Au Nanoparticles
Abstract
Zhiyang Li, University of Massachusetts Lowell, Lowell, MA

Session D:

SMT and Electronics Packaging

Session Chairs: Michael Jansen and Tina Barcley

An Overview of IPC Plating Specification Completions, Revisions and Future Plans
Abstract Paper Presentation
George Milad, Uyemura International Corp., Southington, CT

Solder Fatigue in Tin-Lead and Silver-Tin-Copper (ROHs) Solders
Abstract Paper Presentation
Tina Barcley, TAS Consulting, Rochester, NY

A Thermally Functionalized Structural Material for Heat Spreading in Handheld Devices
Abstract Presentation
Aaron Vodnick, Materion Technical Materials Inc., Lincoln RI

Electromagnetic Compatibility Testing in an All-Electric Vehicle
Abstract Paper Presentation
Lennart E. Long, LenLong and Associates, Inc., Waltham, MA

The Future of Solder Joint Encapsulant
Abstract Presentation
Dr. Wusheng Yin, YINCAE Advanced Materials, LLC, Albany, NY

Session E:

Printed Electronics

Session Chairs: Dr. Craig Armiento and James Zunino III

3D Printed Electronics Functionalizing Smart Devices which are Empowering the Industrial Internet of Things
Abstract Presentation
Mike O’ReillyOptomec, Inc., Albuquerque , NM

Flexible, Printed Electronics for Sensing and Energy Storage
Abstract Presentation
Dr. Erik Handy, SI2 Technologies, North Billerica, MA

Reconfigurable Printed Phased Array Antennas
Abstract Presentation
Alkim Akyurtlu, University of Massachusetts Lowell, Lowell, MA

Printing Functional Materials
Abstract Presentation
Dr. Scott Slimmer, Harvard School of Engineering and Applied Sciences, Cambridge, MA

Additive Manufacturing and Integration of Electronics for Military Systems and Applications
Abstract Presentation
James L Zunino III, US Army RDECOM, Picatinny Arsenal, Rockaway Township, NJ

Session F:

RF and Microwave: Innovations & Emerging Technologies - Part II

Session Chairs: Tom Terlizzi , and Dr. Chandra Gupta

Advanced Packaging Concepts for Manufacturing
Abstract Paper
Dr. Hormazdyar (Homi) Dalal, Analog Devices Inc.

Ametek Electronic Packaging S-Bend Ceramic Feedthrough
Abstract Presentation
Ken McGillivray, Ametek, New Bedford, MA

Liquid Crystal Polymer Substrates to Enable Advanced RF and Medical Applications
Abstract Presentation
Susan Bagen, Micro Systems Technologies, Inc., Mesa, AZ;

Projection Welded Hermetic Ring Seals – At the Intersection of Physics and Electronic Packaging Technology
Abstract Presentation MS Powerpoint version
Tom Salzer, Hermetic, Inc., 24 Dunelm Rd, Bedford, MA

Session G:

Cu Wire and Advanced Interconnect Technologies

Session Chairs: Mike McKeown and Bill Boyce

Critical Barriers Associated with Copper Wire
Abstract Presentation
William (Bud) Crockett Jr. , Tanaka, San Francisco Bay Area, CA

Physical RF Circuit Techniques and Their Implications on Future Power Module and Power Electronic Design
Abstract Presentation
Adam Morgan, NCSU, Raleigh, NC

Accelerating Reliability Assessment with Multi-Oven Racks and Sensor Chips for Wire Bonds
Abstract Presentation
Michael Mayer , J. Gomes, University of Waterloo, ON, Canada

Enhancement of Transient Heat Transfer of Phase Change Material for Electronics Cooling and Energy Storage
Abstract
Shibin Liang, Aavid Thermalloy, Laconia, NH

Session H:

Poster Session

Session Chairs: Dr. Zhiyong Gu and Dr. Rita Mohanty

Robots, Robots Everywhere
Abstract
Scott Mazur, Benchmark Electronics – Nashua, NH

Structural Characterization and Phase Behavior of Sn/In Nanosolders at Elevated Temperatures
Abstract
Yang Shu, T. Ando (2), Z. Gu (1) 1 - Dept. of Chemical Eng., Univ. of MA Lowell, Lowell, MA, 2 - Dept. of Mech. & Industrial Eng., Northeastern University, Boston, MA

Magnetically Assembling Nanoscale Metal Network into Phase Change Material – Percolation Threshold Reduction in Paraffin Using Magnetically Assembly of Nanowires
Abstract Presentation
Junwei Su (1), X. Liu(1), F. Gao(2), I. Mirzaee (1), M. Charmchi (1), Z. Gu(2), H. Sun(1); 1 - Dept. of Mechanical Eng., 2 - Dept. of Chemical Eng., Univ. of MA Lowell, Lowell, MA

Synthesis and Characterization of Novel Magnetic Core and Solder Shell Nanoparticles Abstract
Edward Fratto, Y. Shu, F. Gao, Z. Gu – Dept. of Chemical Eng., Univ. of MA Lowell, Lowell, MA

A Fiber Optic Ultrasound Transducer for Biomedical Ultrasound Imaging Applications
Abstract Presentation
Nan Wu, J. Zhou, X. Wang – Dept. of Electrical and Computer Eng., Univ. of MA Lowell, Lowell, MA

Synthesis and Catalytic Properties of Silica-Cobalt Core-Shell Nanoparticles
Abstract
Yan Zhang, F. Gao, Z. Gu – Dept. of Chemical Eng., Univ. of MA Lowell, Lowell, MA

Development of Pb-free and Halogen-free Nanosolder-Enabled Solder Pastes
Abstract
Evan Wernicki, F. Gao (1), G. Morose (2), Z. Gu (1),1 - Dept. of Chemical Eng., Univ. of MA Lowell, Lowell, MA; 2 - Toxics Use Reduction Institute (TURI), Lowell, MA

Deposition Characteristics and Electrical Properties of Silver and CNT Inks Deposited by Aerosol Jet
Abstract Presentation
Peter Lewis (1,2), P. Kumar (2), R.D. White (2), B.R. Smith (2), 1 - Tufts University, Medford, MA; 2 - Draper Laboratory, Cambridge, MA

Photos of 2014 - 2015 Meetings - Photographer: Joseph W. Soucy

Symposium May 6, 2014
Photos I
Photos II
Photos III

SMTA New England IMAPS September 10, 2014 Technical Meeting & Plant Tour
Photos I

ACerS New England IMAPS January 14, 2015 Technical Meeting
Photos I

New England IMAPS December 2, 2014 Holiday Party
Photos I

New England IMAPS June 24, 2015 Annual Meeting
Photos

New England IMAPS June 28, 2014 President's Volunteer Day
Photos

New England IMAPS March 24, 2015 Technical Meeting
Photos
Presentation

New England IMAPS October 28, 2015 Technical Meeting
Photos

New England IMAPS July 15, 2014 Roger Benson
Photos

2015 Symposium Sponsors
Tuesday May 6th 2015
Holiday Inn Boxborough Woods, Boxborough MA
Call for Papers 2016
Earlybird Exhibitor Registration 2016
iMAPS New England Chapter

iMAPS - INTERNATIONAL MICROELECTRONICS AND PACKAGING SOCIETY